How to choose between silicone thermal conductive pads and thermally conductive gap fillers?
Time: 2024-08-09 17:18:18     Copyfrom: SuZhou Volsun Electronics Technology Co.,Ltd.

Volsun thermally conductive silicone pads and thermally conductive gap fillers are commonly used in various applications to improve thermal conductivity. However, they have different characteristics and are suitable for different scenarios.  The question arises: which is the most suitable for your particular use case?

Let’s delve into the primary distinctions between these two products.

Silicone thermal pads are solid and soft, while thermally conductive gap fillers are liquid or gel-like with good flowability. 

Silicone thermal pads have a thermal conductivity ranging from 0.8W/M·K to 8.0W/M·K, whereas thermally conductive gap fillers typically have a thermal conductivity above 2.0W/M·K. The fluidity of gap fillers allows them to fill gaps more effectively, reducing interface thermal resistance and improving thermal conductivity. 

Silicone pads offer good insulation, preventing short circuits or leakage in electronic devices. Thermally conductive gap fillers also provide insulation, but the level of insulation depends on the type and formulation of the product.

In addition, thermally conductive silicone pads are solid and can be cut into shapes for easy installation and maintenance. On the other hand, thermal conductive gap fillers need dispensing equipment for application and are ideal for automated production.

To sum up,  the choice between thermally conductive silicone pads and thermal conductive gap fillers should be based on specific application needs, cost considerations, and ease of use. For rapid heat dissipation, automated production, or one-time use, thermal conductive gap fillers may be preferred. For reusable, easy-to-cut, or specific shape requirements, thermally conductive silicone pad will be a better choice.

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