Factory Customized 6w/m.k Soft Silicone Material thermal Conductivity Pads
- Detailed
Volsun VS-GP6001 Silicone thermal pads achieve low interfacial thermal resistance at relatively low pressures, with excellent thermal conductivity, thermal stability, flexibility and resilience, safe and reliable use. Applied between the power device and the cooling aluminum sheet or the machine shell, the air can be effectively excluded to achieve good thermal conductivity filling effect.
Features
Operating temperature: -40℃~+200℃
High thermal conductivity, low thermal resistance
Excellent surface wettability and resilience
Excellent flame retardancy
Multiple thickness selection, wide application range
Environmental protection standards: RoHS, REACH
Item
Typical value
Test method
color
Gary
Visual inspection
Density (g/cm3)
3.4
ASTM D792
Thickness (mm)
0.5~5.0
ASTM D374
Hardness (Shore OO)
45-70
GB/T 531.1-2008
Tensile strength (KPa)
≥80
GB/T 528-2009
Elongation at break (%)
≥10
GB/T 528-2009
Thermal conductivity (W/m·k)
6.0
ASTM D5470
Flame Rating
V-0
UL94
Dielectric Breakdown Voltage (kV)
>6
ASTM D149
Volume resistivity
≥1.0×10 12
ASTM D257
Technical Performance