Volsun VS-TP1501 Thermal Conductive Silicone Potting Compound for Electronic Components
Time: 2024-05-24 13:46:53 Copyfrom: SuZhou Volsun Electronics Technology Co.,Ltd.
Description
VS-TP1501 is a two-component 1:1 heat-curing silicone heat-conductive potting adhesive, which cures at room temperature or after heating to form elastic heat-conductive silicone rubber. It is specially designed for the manufacture of electronic and electrical products and modules, such as the potting protection of high-power power supply modules, frequency converters, sensors, etc., and the connection and fixation between on-board electronic devices and PCBs.
Features
- Operating temperature: -40℃~+200℃
- Excellent mechanical properties and ductility
- Excellent thermal conductivity and aging resistance
- Low viscosity, self-leveling, excellent seam drilling ability
- Low modulus, low stress, good adhesion to metals and plastics
Technical Performance
Item
Typical value
Test method
Mixing ratio
1:1
/
Color (After mixing)
Grey
Visual inspection
Viscosity(Component A) @25℃
3000-5000cps
ASTM D2196
Viscosity(Component B) @25℃
3000-5000cps
ASTM D2196
Viscosity(After
mixing) @25℃
3000-5000cps
ASTM D2196
Opening
hours@25℃
≥60min
/
Curing condition
20min/100℃ 30min/80℃
/
Thermal conductivity
1.3±0.2 W/m·k
ASTM D5470
Hardness
50±5 Shore A
GB/T 531.1-2008
Density
2.2±0.2 g/cm3
GB/T 1033.1-2008
Tensile strength
＞0.2 MPa
GB/T 528-2009
Elongation at break
＞10%
GB/T 528-2009
Flame retardant rating
V-0
UL94
Breakdown
strength
≥15 kV/mm
GB/T 1695-2005
Volume
resistivity
≥ 1.0×1013 Ω·cm
GB/T 1692-2008
Dimensions
Type
Packing
VS-TP1501（1kg）
Component A 0.5kg; Component B 0.5kg
VS-TP1501（20kg）
Component
A 10kg; Component B 10kg
VS-TP1501（40kg）
Component
A 20kg; Component B 20kg
VS-TP1501（80kg）
Component
A 40kg; Component B 40kg
VS-TP1501（100kg）
Component
A 50kg; Component B 50kg
Instructions
- Stirring A and B components separately
- Mixing the well-stirred components A and B at the ratio of 1:1 (either volume ratio/weight ratio can be used)
- The mixed compound is poured into the device to be filled and cured (room temperature or heating can be cured).
Cautions
- In order to ensure the uniform distribution of fillers, component A and component B must be separately stirred before mixing, so that each compound is evenly mixed
- A and B agents will react and cure each other after mixing, so they need to be used after mixing, and can not be used twice after mixing and curing
- When pouring into the protective part, there should be no large debris or other pollutants in the protective part to avoid affecting the adhesion of materials and objects
- Before the material is fully cured, keep other objects away from the material, which may affect the appearance and protective performance of the material
- Keep this product away from the mouth and eyes. If it enters the mouth and eyes accidentally, rinse it with clean water or go to the hospital
- For high thermal conductivity, vacuum defoaming is required prior to perfusion
- In low temperature environment, the curing time will be extended correspondingly
Storage conditions and shelf life
- Products should be stored in the original packaging, keep the lid closed, avoid contamination (temperature: 15℃ < T < 30℃; Relative humidity: RH < 70%) (temperature: 15℃ < T < 30℃; Relative humidity: RH < 70%
- The shelf life is 6 months from the production date
KEYWORD:Thermal conductivity,Potting compound
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